Description
Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.5 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions
PD VF RthJA TJ TSTG
IF=200mA
Note: Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.TAI
Features
- Planar Die Construction.
- 500mW Power Dissipation.
- Very Sharp Reverse Characteristic.
- Very High Stability www. DataSheet4U. com.
- Low Reverse Current Level.
- Standard Zener Voltage Tolerance is ± 5 %.
- Ideally Suited for Automated Assembly Processes.
- RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-750, Method 2026 Color band denotes cathode end Approx. 0.03.
ZMMC10_TAITRON.pdf