CP201209T-260x
TaeJin
1.29MB
Multilayer chip beads.
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CP201209T-201x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-220x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-221x - Multilayer Chip Beads
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Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-241x - Multilayer Chip Beads
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Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-251x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-280x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-050x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-070x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-101x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-102x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..