CP201209T-391x
TaeJin
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Multilayer chip beads.
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CP201209T-390x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-300x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-301x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-310x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-320x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-331x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-050x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-070x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-101x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..
CP201209T-102x - Multilayer Chip Beads
(TaeJin)
Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk..