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ES3DV - Surface Mount Ultra Fast Rectifier

Datasheet Summary

Description

ES3DVHR7G ES3DV H R7 G AEC-Q101 qualified Green compound 2 Version:C1903 ES3DV Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) AVERAGE FORWARD CURRENT (A) Fig.1 Forward Current Derating Curve 3.5 3 2.5 2 1.5 1 0.5 0 0 25 50 75 100 125 150 LEAD

Features

  • Glass passivated chip junction.
  • Ideal for automated placement.
  • Super fast recovery time for high efficiency.
  • Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC.
  • Halogen-free according to IEC 61249-2-21.

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Datasheet Details

Part number ES3DV
Manufacturer Taiwan Semiconductor
File Size 297.43 KB
Description Surface Mount Ultra Fast Rectifier
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ES3DV Taiwan Semiconductor 3A, 200V Surface Mount Ultra Fast Rectifier FEATURES ● Glass passivated chip junction ● Ideal for automated placement ● Super fast recovery time for high efficiency ● Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● High frequency rectification ● Freewheeling application ● Switching mode converters and inverters in computer, automotive and telecommunication. KEY PARAMETERS PARAMETER VALUE UNIT IF(AV) VRRM IFSM TJ MAX Package 3 A 200 V 100 A 150 °C DO-214AB (SMC) Configuration Single die MECHANICAL DATA ● Case: DO-214AB (SMC) ● Molding compound meets UL 94V-0 flammability rating ● Part no.
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