Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package
Built-in stain relief, ideal for automatic placement
Fast switching for high efficiency
High temperature soldering: 260℃/10 seconds at terminals
Meet MSL level 1, per J-STD-020D, lead free maximum peak of 260℃
Plastic material used carries Underwriters Laboratory Classification 94V-0
Green compound with suffix "G" on packing code & prefix "G" on datecode
Mechanical Dat.