Description
Multiple manufacture source Define manufacture source
PACKAGE OUTLINE DIMENSIONS MELF
SUGGEST PAD LAYOUT
DIM.A B C `
Unit (mm)
Min 4.80 2.25 0.30
Max 5.50 2.67 0.60
Unit (inch)
Min 0.189 0.089 0.012
Max 0.217 0.105 0.024
DIM.C G X X1 Y
Unit (mm)
Typ.4.80 3.30 1.50 6.30 2.70
Unit (inch)
Typ.0.189 0.130 0.059 0.248 0.106
Document Number: DS_S1412011
Version: G14
Small Signal Product
LSR102 thru LSR106
Taiwan Semiconductor
Notice
Specifications of the products displayed herein
Features
- - Plastic package has carries underwriters - Ideal for automated placement - Surge overload rating to 25 Ampers peak - Reliable low cost construction utilizing molded
plastic technique results in in-expensive product
- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
- Terminal : Pure tin plated,lead free - Weight : 0.12 grams
MELF.
LSR102-TaiwanSemiconductor.pdf
