TC358774XBG Datasheet - Toshiba

TC358774XBG Mobile Peripheral

TC358774XBG/TC358775XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358774XBG/TC358775XBG Mobile Peripheral Devices Overview TC358774XBG The TC358774XBG/TC358775XBG Functional Specification defines operation of the DSISM to LVDS low power chip (or more abbreviated, TC358775XBG chip). TC358775XBG is the follow-up chip of TC358764XBG/ TC358765XBG, which: 1. Is pin compatible to TC358764XBG/TC358765XBG P-VFBGA49-0505-0.65-001 Weight: 39 mg (Typ.) 2. Exhibit LVDS Tx block operates .

TC358774XBG Features

* DSI Receiver

* Configurable 1- up to 4-Data-Lane DSI Link with bi-directional support on Data Lane 0

* Maximum bit rate of 1 Gbps/lane

* Video input data formats: - RGB565 16-bits per pixel - RGB666 18-bits per pixel - RGB666 loosely packed 24-bits per pixel - RGB888 24-bits per pi

TC358774XBG Datasheet (391.76 KB)