THGBMBG5D1KBAIL Datasheet - Toshiba

THGBMBG5D1KBAIL, 4GB density e-MMC

THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA.

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THGBMBG5D1KBAIL-Toshiba.pdf

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Datasheet Details

Part number:

THGBMBG5D1KBAIL

Manufacturer:

Toshiba ↗

File Size:

1.02 MB

Description:

4GB density e-MMC

Features

* THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC N

THGBMBG5D1KBAIL Distributors

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THGBMBG5D1KBAIL 4GB density e-MMC Toshiba

Toshiba THGBMBG5D1KBAIL-like datasheet