Datasheet Details
- Part number
- THGBMBG5D1KBAIL
- Manufacturer
- Toshiba ↗
- File Size
- 1.02 MB
- Datasheet
- THGBMBG5D1KBAIL-Toshiba.pdf
- Description
- 4GB density e-MMC
THGBMBG5D1KBAIL Description
THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA.
THGBMBG5D1KBAIL Features
* THGBMBG5D1KBAIL Interface
THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection
P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package)
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12 NC NC NC N
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