THGBMDG5D1LBAIL Datasheet - Toshiba

THGBMDG5D1LBAIL, e-MMC Module

THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BG.

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THGBMDG5D1LBAIL-Toshiba.pdf

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Datasheet Details

Part number:

THGBMDG5D1LBAIL

Manufacturer:

Toshiba ↗

File Size:

1.16 MB

Description:

e-MMC Module

Features

* THGBMDG5D1LBAIL Interface THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC N

THGBMDG5D1LBAIL Distributors

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THGBMDG5D1LBAIL e-MMC Module Toshiba

Toshiba THGBMDG5D1LBAIL-like datasheet