Click to expand full text
THGBMDG5D1LBAIL
4GB THGBMDG5D1LBAIL
TOSHIBA e-MMC Module
INTRODUCTION
THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMDG5D1LBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMDG5D1LBAIL Interface
THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection
P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max.
THGBMDG5D1LBAIL Datasheet
