THGBMDG5D1LBAIL

e-MMC Module

Toshiba

THGBMDG5D1LBAIL Features

* THGBMDG5D1LBAIL Interface THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC N

THGBMDG5D1LBAIL Datasheet (1.16 MB)

THGBMDG5D1LBAIL Datasheet Preview — Preview of THGBMDG5D1LBAIL PDF

Datasheet Details

Part number:

THGBMDG5D1LBAIL

Manufacturer:

Toshiba ↗

File Size:

1.16 MB

Description:

E-mmc module.
THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BG.

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