THGBMHG7C1LBAIL

16GB density of e-MMC Module

Toshiba

THGBMHG7C1LBAIL Features

* THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC N

THGBMHG7C1LBAIL Datasheet (0.99 MB)

THGBMHG7C1LBAIL Datasheet Preview — Preview of THGBMHG7C1LBAIL PDF

Datasheet Details

Part number:

THGBMHG7C1LBAIL

Manufacturer:

Toshiba ↗

File Size:

0.99 MB

Description:

16gb density of e-mmc module.
THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball B.

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