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TGB2010 Bessel Filter

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Description

Product Data Sheet August 5, 2008 Bessel Filter * * * * * * TGB2010 Key .

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Datasheet Specifications

Part number
TGB2010
Manufacturer
TriQuint Semiconductor
File Size
343.98 KB
Datasheet
TGB2010_TriQuintSemiconductor.pdf
Description
Bessel Filter

Features

* and Performance 6, 7, 8, 9, 10 & 11 GHz Filters 15dB Return Loss to 2Fo Filter Bandwidth ± 0.5 GHz 3MI Technology Chip Dimensions: 0.49 x 0.49 x 0.10 mm (0.019 x 0.019 x 0.004 inches) Preliminary Measured Performance 0 -1 -2 -3 Gain (dB) -4 -5 -6 -7 -8 -9 -10 0 1 2 ww

Applications

* Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical. Interconnect process assembly notes:
* Thermo

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