TQHBT3 Datasheet - TriQuint Semiconductor

TQHBT3, InGaP HBT Foundry Service

Production Process InGaP HBT Foundry Service .
TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performanc.

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Datasheet Details

Part number:

TQHBT3

Manufacturer:

TriQuint Semiconductor

File Size:

148.94 KB

Description:

InGaP HBT Foundry Service

Features

* Metal 2 - 4um TQHBT3
* MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um www. DataSheet4U. com B C B C NiCr Base Collector
* Sub Collector Buffer & Substrate
* TQHBT3

Applications

* InGaP Emitter Process for High Reliability and Thermal Stability Base Etch Stop for Uniformity MOCVD Epitaxy High Density Interconnects;
* 2 Global, 1 Local
* Over 6 µm Total Thickness
* Dielectric Encapsulated Metals Thick Metal Interconnects:
* Enhanced Thermal Mana

TQHBT3 Distributors

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TQHBT3 InGaP HBT Foundry Service TriQuint Semiconductor

TriQuint Semiconductor TQHBT3-like datasheet

TQHBT

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