TQHBT3

InGaP HBT Foundry Service

TriQuint Semiconductor

TQHBT3 Features

* Metal 2 - 4um TQHBT3

* MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um www.DataSheet4U.com B C B C NiCr Base Collector

* Sub Collector Buffer & Substrate

* TQHBT3

TQHBT3 General Description

TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance. Thick metal interconnects and high quality passives promote integration. The thick metal interconnects, which promote enhanced thermal management, .

TQHBT3 Datasheet (148.94 KB)

TQHBT3 Datasheet Preview — Preview of TQHBT3 PDF

Datasheet Details

Part number:

TQHBT3

Manufacturer:

TriQuint Semiconductor

File Size:

148.94 KB

Description:

Ingap hbt foundry service.

📁 Related Datasheet

TQHBT 100UA Gain Selectable Amplifier (TriQuint Semiconductor)

TQH10A Current Transducer (Topstek)

TQH15A Current Transducer (Topstek)

TQH25A Current Transducer (Topstek)

TQH37.5A Current Transducer (Topstek)

TQH50A Current Transducer (Topstek)

TQH5A Current Transducer (Topstek)

TQH7.5A Current Transducer (Topstek)

TQHIP 100UA Gain Selectable Amplifier (TriQuint Semiconductor)

TQHV10A Current Transducers (Topstek)

TAGS

TQHBT3 InGaP HBT Foundry Service TriQuint Semiconductor

Image Gallery

TQHBT3 Features

TQHBT3 General Description

Datasheet Details

File Size:

Description:

TQHBT3 Distributor