10 views

TQHBT3 Datasheet - TriQuint Semiconductor

TQHBT3 InGaP HBT Foundry Service

TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance. Thick metal interconnects and high quality passives promote integration. The thick metal interconnects, which promote enhanced thermal management, .

TQHBT3 Features

* Metal 2 - 4um TQHBT3

* MIM Metal 0 Isolation Implant Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um www.DataSheet4U.com B C B C NiCr Base Collector

* Sub Collector Buffer & Substrate

* TQHBT3

TQHBT3 Datasheet (148.94 KB)