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MA4DP918-1277 HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS

MA4DP918-1277 Description

HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 .
The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process.

MA4DP918-1277 Features

* n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Requir

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Datasheet Details

Part number
MA4DP918-1277
Manufacturer
Tyco Electronics
File Size
135.51 KB
Datasheet
MA4DP918-1277_TycoElectronics.pdf
Description
HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS

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HMICTM Integrated Passive Diplexer GSM DCS AMPS PCS Tyco Electronics
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