MA4DP918-1277 Datasheet - Tyco Electronics

MA4DP918-1277 HMICTM Integrated Passive Diplexer GSM/DCS / AMPS/PCS

The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium. The glass al.

MA4DP918-1277 Features

* n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Requir

MA4DP918-1277_TycoElectronics.pdf