GMZ3.0 Features
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.01 g
Datasheet Details
GMZ3.0, GMZ2.0
UPM
726.40 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: GMZ3.0, GMZ2.0.
Please refer to the document for exact specifications by model.
GMZ3.0 Distributor
📁 Related Datasheet
📌 All Tags
