0.190" [4.83 mm] maximum seated height Rugged molded case construction Thick film resistive elements Reduces total assembly cost Low temperature coefficient (- 30 °C to + 85 °C) ± 100 ppm/°C.
Compatible with automatic insertion equipment.
Reduces PC board space.
Lead (Pb)-free version is RoHS compliant
Available
e1
RoHS.