Description
www.DataSheet4U.com PRELIMINARY VTM V *I Chip * VTM Voltage Transformation Module TM V048K030T070 K indicates BGA configuration.For.
The V048K030T070 V.
I Chip Voltage Transformation Module (VTM) breaks records for speed, density and efficiency to meet the demands of advanced.
Features
* ed, destruct margin determined Constant line, 0-100% load, -20°C to 125°C
V
* I Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation Solder ball sh
Applications
* requiring a programmable output voltage at high current and high efficiency. Closing the loop back to an input Pre-Regulation Module (PRM) or DC-DC converter enables tight load regulation. The 3 V VTM achieves break-through current density of 284 A/in3 in a V
* I Chip package compatible with s
