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FCSP130ETR Chip Scale Package Schottky Barrier Rectifier

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Description

FCSP130ETR Vishay High Power Products FlipKY®, 1 A .
True chip-scale packaging is available from Vishay HPP.

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Features

* Ultralow VF per footprint area
* Low thermal resistance
* One-fifth footprint of SMA
* Super low profile (< 0.7 mm)
* Available tested on tape and reel
* Small footprint, surface mountable FlipKY ®
* Low forward voltage drop
* High f

Applications

* requiring low forward drop and very small footprints on PC boards. Typical applications are in disk drives, switching power supplies, converters, freewheeling diodes, battery charging, and reverse battery protection. The FlipKY® package, is one-fifth the footprint of a comparable SMA package and has

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