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FCSP130TR Chip Scale Package Schottky Barrier Rectifier

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Description

FCSP130TR Vishay High Power Products FlipKY®, 1.0 A .
True chip-scale packaging is available from Vishay HPP.

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Datasheet Specifications

Part number
FCSP130TR
Manufacturer
Vishay ↗ Siliconix
File Size
114.39 KB
Datasheet
FCSP130TR_VishaySiliconix.pdf
Description
Chip Scale Package Schottky Barrier Rectifier

Features

* Ultra low VF per footprint area
* Low thermal resistance
* One-fifth footprint of SMA
* Super low profile (< 0.7 mm)
* Available tested on tape and reel
* Small footprint, surface mountable FlipKY® RoHS COMPLIANT
* Low forward voltage drop

Applications

* requiring low forward drop and very small footprints on PC boards. Typical applications are in disk drives, switching power supplies, converters, freewheeling diodes, battery charging, and reverse battery protection. The FlipKY® package, is one-fifth the footprint of a comparable SMA package and has

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