BYG20G-HM3
FEATURES
- Low profile package
- Ideal for automated placement
- Glass passivated pallet chip junction
- Low reverse current
- Soft recovery characteristics
- Ultrafast reverse recovery time
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM
IR VF at IF trr ER TJ max. Package
1.5 A 200 V, 400 V, 600 V
30 A 1.0 μA 1.4 V 75 ns 20 m J 150 °C DO-214AC (SMA)
Diode variations
Single die
TYPICAL APPLICATIONS
For use in high frequency rectification of power supply, inverters, converters, and freewheeling diodes for consumer, automotive and telemunication.
MECHANICAL DATA
Case: DO-214AC (SMA) Molding pound meets UL 94 V-0 flammability rating Base P/N-M3
- halogen-free, Ro HS-pliant, and mercial grade Base P/NHM3
- halogen-free, Ro HS-pliant, and AEC-Q101 qualified
Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD...
