BYV29-300 - Ultrafast Rectifier

Vishay

Datasheet Details

Glass passivated chip junction.
Ultrafast recovery time.
Low switching losses, high efficiency.
Low forward voltage drop.
High forward surge capability.
Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package).
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

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Published: Dec 28, 2013 |