Description
This device has been designed to meet the increasing demand for InGaN technology.
Features
- SMD LED with exceptional brightness.
- Luminous intensity categorized.
- Compatible with automatic placement e3 equipment.
- EIA and ICE standard package.
- Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020B.
- Available in 8 mm tape.
- Low profile package.
- Non-diffused lens: excellent for coupling to light pipes and backlighting.
- Low power consumption.
- Luminous int.
