W3H32M72E-XSBX Datasheet - White Electronic Designs

W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

Symbol ODT Type Input Description W3H32M72E-XSBX PRELIMINARY * On-Die termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is only applied to each of the following balls: DQ0 *DQ71, LDM, UDM, LDQS, LDQS#, UDQS, and UDQS#. The OD.

W3H32M72E-XSBX Features

* Data rate = 667

* , 533, 400 Package:

* 208 Plastic Ball Grid Array (PBGA), 18 x 20mm

* 1.0mm pitch Differential data strobe (DQS, DQS#) per byte www.DataSheet4U.com Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS trans

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W3H32M72E-XSBX Datasheet Preview — Preview of W3H32M72E-XSBX PDF

Datasheet Details

Part number:

W3H32M72E-XSBX

Manufacturer:

White Electronic Designs

File Size:

965.20 KB

Description:

32m x 72 ddr2 sdram 208 pbga multi-chip package.

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W3H32M72E-XSBX W3H32M72E-XSBX 32M DDR2 SDRAM 208 PBGA Multi-Chip Package White Electronic Designs

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