W3H64M72E-XSBX Datasheet, Package, White Electronic Designs

W3H64M72E-XSBX Features

• Package Data rate = 667
• , 533, 400 Package:
• 208 Plastic Ball Grid Array (PBGA), 17 x 23mm
• 1.0mm pitch DDR2 Data Rate = 667
• , 533, 400 Core Supply Voltage = 1

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Part number:

W3H64M72E-XSBX

Manufacturer:

White Electronic Designs

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0.96MB

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📄 Datasheet

Description:

64m x 72 ddr2 sdram 208 pbga multi-chip package. Symbol ODT Type Input Description W3H64M72E-XSBX ADVANCED

www.DataSheet4U.com On-Die termination: ODT (registered HIGH) e

W3H64M72E-XSBX Application

• Applications Upgradable to 128M x 72 density (contact factory for information)
• This product is under development, is not qualified or chara

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W3H64M72E-XSBX

White Electronic Designs

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