* 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm7 3.3 Pin Configuration SOIC 300-mil 8 3.4 Pin Description SOIC 300-mil8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 9 3.6 Ball Description TFBGA 8x6-mm 9 4. PIN DESCRIPTIONS
W25N01GVSFIG Datasheet (2.19 MB)
W25N01GVSFIG
Winbond
2.19 MB
3v 1g-bit serial slc nand flash memory.
W25N01GVxxxG/T/R
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ
Publication Release Date: July 03, 2023 Revis.
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