* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Pin Configuration SOIC 300-mil 8 3.4 Pin Description SOIC 300-mil 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 9 3.6 Ball Description TFBGA 8x6-mm 9 4
W25N01GWSFIG Datasheet (1.15 MB)
W25N01GWSFIG
Winbond
1.15 MB
1.8v 1g-bit serial slc nand flash memory.
W25N01GWxxIG/IT
1.8V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ
Publication Release Date: February 13, 2018 .
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