* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) 8 3.4 Ball Description TFBGA 8x6-mm 8 4. PIN DESCRIPTIONS 9 4.1 Chip Select (/CS) 9 4.2 Serial Data Input, Output and IOs (DI,
W25N02KW
Winbond
2.70 MB
1.8v 2g-bit slc qspinand flash memory.
W25N02KW
1.8V 2G-BIT SLC QSPINAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & SEQUENTIAL READ
Publication Release Date: February 06, 2023 Datasheet .
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