* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration 6x5-mm/ 8x6-mm 6 3.2 Pad Description WSON 6x5-mm/ 8x6-mm 6 3.3 Pin Configuration SOIC 300-mil 7 3.4 Pin Description SOIC 300-mil 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 8 3.6 Ball Description TFBGA 8x6-mm 8
W25Q256JW
Winbond
1.68 MB
1.8v 256m-bit serial flash memory.
W25Q256JW
1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI
Publication Release Date: September 04, 2018 - Revision D
W25Q256JW
Table of Contents
.
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