W25Q40BLDAIP Datasheet, Memory, Winbond

W25Q40BLDAIP Features

• Memory 5 3. PACKAGE TYPES 6 3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil 6 3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm 6 3.3 Pin Configuration PDIP 300-mil 6 3.4 Pin Des

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Part number:

W25Q40BLDAIP

Manufacturer:

Winbond

File Size:

1.80MB

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📄 Datasheet

Description:

2.5v 4m-bit serial flash memory. 5 2. FEATURES 5 3. PACKAGE TYPES 6 3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil 6 3.2 Pad Configuration WSON 6X5-mm

TAGS

W25Q40BLDAIP

Winbond

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