* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pin Configuration SOIC / VSOP 208-mil 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm 6 3.3 Pin Description SOIC/VSOP 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm 6 3.4 Ball Configuration WLCSP 7 3.5 Ball Description WLCSP 7 4. PIN DESCRIPTION
W25Q64FW
Winbond
2.26 MB
1.8v 64m-bit serial flash memory.
W25Q64FW
1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
Publication Release Date: May 18, 2017 Revision N
W25Q64FW
Table of Contents
1. GE.
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