* 3. PACKAGE TYPES AND PIN CONFIGURATIONS 5 3.1 Pin Configuration SOIC 208-mil 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm5 3.4 Pin Configuration SOIC 300-mil 6 3.5 Pin Description SOIC 300-mil6 3.6 Ball Configuration T
W25Q64JV
Winbond
2.32 MB
3v 64m-bit serial flash memory.
W25Q64JV
3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI
For Industrial & Industrial Plus Grade
Publication Release Date: March 10, 2021 Revision K.
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