* 4 3. PIN CONFIGURATION SOIC 150 / 208-MIL 5 4. PAD CONFIGURATION WSON 6X5-MM 5 5. PAD CONFIGURATION PDIP 300-MIL 6 6. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM 6 7. PIN CONFIGURATION SOIC 300-MIL 7 8. PIN DESCRIPTION SOIC 300-MIL 7 8.1 Package Types 8 8.2 Chip S
W25X16BVZPIG Datasheet (1.48 MB)
W25X16BVZPIG
Winbond
1.48 MB
16m-bit serial flash memory.
W25X16BV
16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is recommended for all new 16Mb designs. The W25X16BV is avail.
📁 Related Datasheet
W25X16BV - 16M-BIT SERIAL FLASH MEMORY
(Winbond)
W25X16BV
16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is remended for all new 16Mb designs. The W25X16BV is avail.
W25X16BVDAIG - 16M-BIT SERIAL FLASH MEMORY
(Winbond)
W25X16BV
16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is remended for all new 16Mb designs. The W25X16BV is avail.
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16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is remended for all new 16Mb designs. The W25X16BV is avail.
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(Winbond)
W25X16BV
16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is remended for all new 16Mb designs. The W25X16BV is avail.
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(Winbond)
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16M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
The W25Q16BV is remended for all new 16Mb designs. The W25X16BV is avail.
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Publication Release Date: May 5.
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(Winbond Electronics)
W25X16, W25X16A, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date: May 5.
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