Features
* Halogen-free type
* Lead free product , compliance to RoHs
* Lead less chip form , no lead damage
* Lead-free solder joint , no wire bond & lead frame
* Low power loss , High efficiency
* High current capability , low VF
* Plastic package has Underwriters Laboratory Fla
Applications
* Portable equipment battery applications
* High frequency rectification
* DC / DC Converter
* Telecommunication
MECHANICAL DATA Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026. Polarity : Laser C
