Datasheet4U Logo Datasheet4U.com

BC54-10PAS-Q - 1A NPN medium power transistors

This page provides the datasheet information for the BC54-10PAS-Q, a member of the BC54PAS-Q 1A NPN medium power transistors family.

Datasheet Summary

Description

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

2.

Features

  • High collector current capability IC and ICM.
  • Reduced Printed-Circuit Board (PCB) area requirements.
  • Exposed heat sink for excellent thermal and electrical conductivity.
  • Two current gain selections.
  • Leadless very small SMD plastic package with medium power capability.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint.
  • Qualified according to AEC-Q101 and recommended for use in automotive.

📥 Download Datasheet

Datasheet preview – BC54-10PAS-Q

Datasheet Details

Part number BC54-10PAS-Q
Manufacturer nexperia
File Size 250.85 KB
Description 1A NPN medium power transistors
Datasheet download datasheet BC54-10PAS-Q Datasheet
Additional preview pages of the BC54-10PAS-Q datasheet.

📁 Similar Datasheet

  • BC546 - Amplifier Transistors (Motorola Inc)
  • BC546 - NPN Transistor (NXP)
  • BC546 - NPN Transistor (Fairchild Semiconductor)
  • BC546 - NPN Transistor (Kingtronics)
  • BC546 - NPN Epitaxial Silicon Transistor (ON Semiconductor)
  • BC546 - SILICON NPN TRANSISTORS (Central Semiconductor)
  • BC546 - NPN Transistor (Philips)
  • BC546 - NPN Transistor (RECTRON)
  • BC546 - EPITAXIAL PLANAR NPN TRANSISTOR (KEC)
  • BC546 - NPN Transistor (UTC)
Other Datasheets by nexperia

Full PDF Text Transcription

Click to expand full text
BC54xPAS-Q series 45 V, 1 A NPN medium power transistors 27 April 2023 Product data sheet 1. General description NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. 2. Features and benefits • High collector current capability IC and ICM • Reduced Printed-Circuit Board (PCB) area requirements • Exposed heat sink for excellent thermal and electrical conductivity • Two current gain selections • Leadless very small SMD plastic package with medium power capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Qualified according to AEC-Q101 and recommended for use in automotive applications 3.
Published: |