* High reliability LFPAK56D package, copper-clip, solder die attach and qualified to 175 °C
* Tested to 1 Bn avalanche events
* LFPAK copper clip package technology
* Copper-clip, solder die attach
* High robustness and reliability 3. Applications
* B
PSMN012-60HL Datasheet (284.24 KB)
PSMN012-60HL
284.24 KB
N-channel mosfet.
PSMN012-60HL
N-channel 60 V, 12.5 mOhm, logic level MOSFET in
LFPAK56D using TrenchMOS technology enhanced for
repetitive avalanche
30 September 2.
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