AWT6251 Overview
The AWT6251 meets the increasing demands for higher output power in 3GPP handsets. The PA module is optimized for VREF = +2.85 V, a requirement for patibility with the Qualm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.