ANADIGICS AWT6252
Linear Power Amplifier Module
FEATURES
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● InGaP HBT Technology High Efficiency: 39% Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.56mm Max AWT6252
APPLICATIONS
● Dual Mode 3GPP Wireless Handsets M7 Package 10 Pin 4 x 4 x 1.5 mm Surface Mount Module PRODUCTDESCRIPTION
The AWT6252 meets the increasing demands for higher output power in 3GPP 1XRTT handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 x 4 x 1.5 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.