AWT6252 Description
The AWT6252 meets the increasing demands for higher output power in 3GPP 1XRTT handsets. The PA module is optimized for VREF = +2.85 V, a requirement for patibility with the Qualm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
AWT6252 Key Features
- InGaP HBT Technology High Efficiency: 39% Low Quiescent Current: 50 mA Low Leakage Current in Shutdown Mode: <1 µA VREF