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BL 2012 Series
Multilayer Chip Baluns
Features
Monolithic SMD with small, low-profile and light-weight type.
Applications
0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc.
Specifications
ACX
Advanced Ceramic X
Frequency Unbalanced Balanced Insertion
Part Number Range Impedance Impedance Loss
(MHz)
(ohm)
(ohm)
(dB)
VSWR @BW
Phase Amplitude
Difference Difference
(degree)
(dB)
BL201210B5388_
4900~ 5875
Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity
Part Number
50 100
: 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 12 months max. : 2W max.
1.0 max. 2.0 max. 180 10
2 max.