Datasheet4U Logo Datasheet4U.com

ATS-50230G-C2-R0 - Ultra High Performance BGA Cooling

Features

  • & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard.

📥 Download Datasheet

Datasheet preview – ATS-50230G-C2-R0

Datasheet Details

Part number ATS-50230G-C2-R0
Manufacturer Advanced Thermal Solutions
File Size 318.44 KB
Description Ultra High Performance BGA Cooling
Datasheet download datasheet ATS-50230G-C2-R0 Datasheet
Additional preview pages of the ATS-50230G-C2-R0 datasheet.

📁 Similar Datasheet

  • ATS-1 - (ATS-1/-2) Crystals (MTRONPTI)
  • ATS-2 - (ATS-1/-2) Crystals (MTRONPTI)
  • ATS-25 - Crystal Unit (ETC)
  • ATS-25U - Crystal Unit (ETC)
  • ATS-329 - ATS-329 (Atech)
  • ATS-329A - ATS-329A (Atech)
  • ATS-49 - Crystals (MTRONPTI)
  • ATS137 - SINGLE HALL EFFECT SWITCH (Diodes Incorporated)
  • ATS137 - Single Hall Effect Switch (Anachip)
  • ATS16301 - Self-Calibrating Automatic-TPOS Camshaft Speed Sensor (Allegro)
Other Datasheets by Advanced Thermal Solutions

Full PDF Text Transcription

Click to expand full text
Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-50230G-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm C D » » B A » » Thermal Performance Air Velocity *Image above is for illustration purposes only.
Published: |