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AS4C8M16D1A - 8M x 16 DDR

General Description

Table 2.

Differential Clock: CK, CK are driven by the system clock.

are sampled on the positive edge of CK.

Key Features

  • Fast clock rate: 200MHz.
  • Operating temperature: - Commercial (0~70°C) - Industrial (-40~85°C).
  • Differential Clock CK & CK input.
  • Bi-directional DQS.
  • DLL enable/disable by EMRS.
  • Fully synchronous operation.
  • Internal pipeline architecture.
  • Four internal banks, 2M x 16-bit for each bank.
  • Programmable Mode and Extended Mode registers - CAS Latency: 2, 2.5, 3 - Burst length: 2, 4, 8 - Burst Type: Sequential & Interleave.

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Datasheet Details

Part number AS4C8M16D1A
Manufacturer Alliance Semiconductor
File Size 1.91 MB
Description 8M x 16 DDR
Datasheet download datasheet AS4C8M16D1A Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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8Mx16 DDR1-AS4C8M16D1A Revision History AS4C8M16D1A - 66-pin TSOPII PACKAGE Revision Details Rev 1.1 Preliminary datasheet Date July 2015 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211 Alliance Memory Inc. reserves the right to change products or specification without notice Confidential - 1/66 - Rev.1.1 July 2015 8Mx16 DDR1-AS4C8M16D1A Features • Fast clock rate: 200MHz • Operating temperature: - Commercial (0~70°C) - Industrial (-40~85°C) • Differential Clock CK & CK input • Bi-directional DQS • DLL enable/disable by EMRS • Fully synchronous operation • Internal pipeline architecture • Four internal banks, 2M x 16-bit for each bank • Programmable Mode and Extended Mode registers - CAS Latency: 2, 2.