AWC6323 Overview
AWC6323 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 1 mm surfacemount RoHS pliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings pared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily...
AWC6323 Key Features
- Rev 2.0
- InGaP HBT Technology
- High Efficiency: 37 % @ +27.6 dBm 22 % @ +16 dBm 11 % @ +10 dBm
- Low Quiescent Current: <4 mA
- Internal Voltage Regulation
- Built-in Directional Coupler
- mon VMODE Control Line
- Simplified VCC Bus PCB routing
- Reduced External ponent Count
- Low Profile Surface Mount Package: 1 mm
AWC6323 Applications
- Cell & PCS Dual-band Wireless Handsets and Data Devices for CDMA/EVDO networks