AWC6325 Overview
AWC6325 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 0.9 mm surface mount RoHS pliant package contains independent RF PA paths to ensure optimal performance in both frequency bands in less board area than two single band PAs. The package pinout was chosen to enable handset manufacturers to independently provide bias to both power amplifiers...
AWC6325 Key Features
- InGaP HBT Technology
- High Efficiency
- 37 % @ POUT = +28 dBm
- 20 % @ POUT = +16 dBm
- 10 % @ POUT = +10 dBm
- Low Quiescent Current: 4 mA
- Internal Voltage Regulation
- Built-in Directional Coupler
- mon VMODE Control Line
- Suitable for SMPS and average power tracking systems with variable supply voltages