ADP165 Datasheet PDF

THERMAL PERFORMANCE

OF THE PACKAGE. VOUT 1 ADJ 2 GND 3 TOP VIEW (Not to Scale) ADP165/ ADP166 6 VIN 5 NC 4 EN NOTES 1. NC = NO CONNECT. NOT CONNECTED INTERNALLY. 2. THE EXPOSED PAD MUST BE CONNECTED TO GROUND. THE EXPOSED PAD ENHANCES THE

THERMAL PERFORMANCE

OF THE PACKAGE. 12188-007 12188-006 1 A 2 VOUT VIN ADP165 B EN GND 12188-008 TOP VIEW (Not to Scale) 3.35 3.34 3.33 3.32 GROUND CURRENT (µA) 1µA 100µA 1mA 10mA 100mA 150mA 100 10 VOUT (V) 3.31 3.30 3.29 3.28 3.27 3.26 12188-109 1 NO LOAD 1µA 100µA 1mA 10mA 100mA 150mA –25 0 25 50 75 100 125 150 JUNCTION TEMPERATURE (°C) 12188-112 3.25 –50 –25 0 25 50 75 100 125 150 0.1 –50 JUNCTION TEMPERATURE (°C) 3.35 100 3.34 3.33 3.32 GROUND CURRENT (µA) 10 VOUT (V) 3.31 3.30 3.29 3.28 1 3.27 3.26 12188-110 0.01 0.1 1 ILOAD (mA) 10 100 1000 0.01 0.1 1 ILOAD (mA) 10 100 1000 3.33 3.32 3.31 100 3.30 VOUT (V) 3.29 3.28 GROUND CURRENT (µA) 10 3.27 3.26 3.25 1µA 100µA 1mA 10mA 100mA 150mA 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 12188-111 1 3.24 3.23 3.7...