SS15P50 Overview
Key Features
- typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
