Part B140WS
Description 1A Surface Mount Schottky Barrier Rectifiers
Manufacturer Chip Integration Technology
Size 445.92 KB
Chip Integration Technology
B140WS

Overview

  • Tiny plastic SMD package.
  • Low power loss, high efficiency.
  • High current capability, low forward voltage drop.
  • High surge capability.
  • Guardring for overvoltage protection.
  • Ultra high-speed switching.
  • Silicon epitaxial planar chip, metal silicon junction.
  • Suffix "G" indicates Halogen-free part, ex.B140WSG.
  • Lead-free parts meet environmental standards of