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DAN217N3 - HIGH-SPEED SWITCHING DIODE

General Description

The DAN217N3 consists of two diodes in a plastic surface mount package.

The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits.

Key Features

  • Small SMD Package (SOT-23).
  • Ultra-high Speed.
  • Low Forward Voltage.
  • Fast Reverse Recovery Time Absolute Maximum Ratings.
  • Maximum Temperatures Storage Temperature -65 ~ +150 °C Junction Temperature +150 °C.
  • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) 250 mW.
  • Maximum Voltages and Currents (Ta=25°C) Reverse Voltage 120 V Repetitive Reverse Voltage 120 V Forward Current 215 mA Repetitive Forward Current 500 mA Forward.

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Datasheet Details

Part number DAN217N3
Manufacturer CYStech
File Size 214.46 KB
Description HIGH-SPEED SWITCHING DIODE
Datasheet download datasheet DAN217N3 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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CYStech Electronics Corp. HIGH-SPEED SWITCHING DIODE DAN217N3 Spec. No. : C303N3C Issued Date : 2002.12.18 Revised Date :2013.09.06 Page No. : 1/6 Description The DAN217N3 consists of two diodes in a plastic surface mount package. The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits. Features • Small SMD Package (SOT-23) • Ultra-high Speed • Low Forward Voltage • Fast Reverse Recovery Time Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................................. -65 ~ +150 °C Junction Temperature............................................................................................................