MTP2301S3 Description
CYStech Electronics Corp. 2013.08.29 Revised Date.
MTP2301S3 Key Features
- Advanced trench process technology
- High density cell design for ultra low on resistance
- Excellent thermal and electrical capabilities
- pact and low profile SOT-323 package
- Pb-free lead plating and halogen-free package
- 20V -1.6A 75mΩ(typ.) 113mΩ(typ.)