CP734V Datasheet | Central Semiconductor

.. PROCESS CP734V Small Signal Transistors - Chopper Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY EPITAXIAL PLANAR 31.5 x 31.5 MILS 7.0 MILS 4.7 x 6.7 MILS 4.7 x 8.7 MILS Al - 30,000Å Au - 18,000Å GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES CMPT404A MPS404A w w w. c e n t r a l s e m i . c o m R2 (22-March 2010) PROCESS CP734V Typical Electrical Characteristics w w w. c e n t r a l s e m i . c o m R2 (22-March...