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PROCESS
Small Signal Transistors
PNP - Chopper Transistor Chip
CP734V
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PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES CMPT404A MPS404A EPITAXIAL PLANAR 31.5 x 31.5 MILS 7.0 MILS 4.7 x 6.7 MILS 4.7 x 8.7 MILS Al - 30,000Å Au - 18,000Å
R2 (22-March 2010)
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PROCESS
CP734V
Typical Electrical Characteristics
R2 (22-March 2010)
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CP734V Datasheet
