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PROCESS
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CPQ165
TRIAC
25 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 376 PRINCIPAL DEVICE TYPES CQDD-25M Series CQ220-25M Series CQ220-25MFP Series Glass Passivated Mesa 165 x 165 MILS 8.6 MILS ± 0.6 MILS 134 x 83 MILS 35 x 35 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å
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CPQ165 Datasheet
