HYG053N10NS1D Description
TO-251-3L V:TO-251-3S Date Code XYMXXXXXX ip Note: ChipSourceTek lead-free products contain molding pounds/die attach materials and 100% matte tin plate h Termi-Nation finish;which are fully pliant with RoHS. ChipSource lead-free products meet or exceed the lead- Free require-ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature.